Adopting standard module technology for cross-border design, standard 27 inch, 27.5 inch, and 55 inch are used to create ultra-thin flat panel surface light sources with soft and uniform lighting and excellent heat dissipation. Adopting high-precision small pitch LED positive/reverse COB packaging technology, the LED chip is directly packaged onto the PCB substrate.
Attention: The images and content description of the current product are only for demonstration purposes and may not be consistent with the current product! .p_d_002 img{ display: block; margin: 0 auto; max-width: 100%; }
